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INTEGRATED CIRCUITS
DATA SHEET
74LVC162374A; 74LVCH162374A 16-bit edge triggered D-type flip-flop with 30 series termination resistors; 5 V input/output tolerant; 3-state
Product specification File under Integrated Circuits, IC24 1999 Aug 05
Philips Semiconductors
Product specification
16-bit edge triggered D-type flip-flop with 30 series 74LVC162374A; termination resistors; 5 V input/output tolerant; 3-state 74LVCH162374A
FEATURES * ESD protection: HBM EIA/JESD22-A114-A exceeds 2000 V MM EIA/JESD22-A115-A exceeds 200 V * 5 V tolerant input/output for interfacing with 5 V logic * Wide supply voltage range of 1.2 to 3.6 V * Complies with JEDEC standard no. 8-1A * CMOS low power consumption * MULTIBYTETM flow-through standard pin-out architecture * Low inductance multiple power and ground pins for minimum noise and ground bounce * Direct interface with TTL levels * All data inputs have bus hold (74LVCH162374A only) * High impedance when VCC = 0 * Power off disables outputs, permitting live insertion. FUNCTION TABLE See note 1. INPUTS OPERATION MODES nOE Load and read register Latch register and disable outputs Note 1. H = HIGH voltage level; h = HIGH voltage level one set-up time prior to the HIGH-to-LOW LE transition; L = LOW voltage level; l = LOW voltage level one set-up time prior to the HIGH-to-LOW LE transition; Z = high-impedance OFF-state; = LOW-to-HIGH CP transition. L L H H nCP nDn l h l h INTERNAL FLIP-FLOPS L H L H OUTPUTS Q0 to Q7 L H Z Z DESCRIPTION The 74LVC(H)162374A is a 16-bit edge triggered flip-flop featuring separate D-type inputs for each flip-flop and 3-state outputs for bus oriented applications. The 74LVC162374A consists of 2 sections of eight edge-triggered flip-flops. A clock (CP) input and an output enable (OE) are provided for each octal. Inputs can be driven from either 3.3 or 5 V devices. In 3-state operation, outputs can handle 5 V. These features allow the use of these devices in a mixed 3.3 and 5 V environment. The flip-flops will store the state of their individual D-inputs that meet the set-up and hold time requirements on the LOW-to-HIGH CP transition. When OE is LOW, the contents of the flip-flops are available at the outputs. When OE is HIGH, the outputs go to the high-impedance OFF-state. Operation of the OE input does not affect the state of the flip-flops. The 74LVCH162374A bus hold data inputs eliminates the need for external pull up resistors to hold unused inputs. The 74LVC(H)162374A is designed with 30 series termination resistors in both HIGH and LOW output stages to reduce line noise.
1999 Aug 05
2
Philips Semiconductors
Product specification
16-bit edge triggered D-type flip-flop with 30 series termination resistors; 5 V input/output tolerant; 3-state
QUICK REFERENCE DATA GND = 0 V; Tamb = 25 C; tr = tf 2.5 ns. SYMBOL tPHL/tPLH fmax CI CPD Note 1. CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD x VCC2 x fi + (CL x VCC2 x fo) where: fi = input frequency in MHz; fo = output frequency in MHz; (CL x VCC2 x fo) = sum of outputs; CL = output load capacitance in pF; VCC = supply voltage in Volts. ORDERING INFORMATION PACKAGE OUTSIDE NORTH AMERICA 74LVC162374ADL 74LVC162374ADGG 74LVCH162374ADL 74LVCH162374ADGG PINNING PIN 1 2, 3, 5, 6, 8, 9, 11, 12 4, 10, 15, 21, 28, 34, 39, 45 7, 18, 31, 42 24 25 1OE 1Q0 to 1Q7 GND VCC 2OE 2CP SYMBOL 3-state flip-flop outputs ground (0 V) DC supply voltage 3-state flip-flop outputs output enable input (active LOW) clock input data inputs data inputs clock input NORTH AMERICA VC162374A DL VC162374A DGG VCH162374A DL VCH162374A DGG TEMPERATURE RANGE -40 to +85 C PINS 48 48 48 48 PACKAGE SSOP TSSOP SSOP TSSOP PARAMETER propagation delay CP to Qn maximum clock frequency input capacitance power dissipation capacitance per flip-flop VCC = 3.3 V; note 1 CONDITIONS CL = 50 pF; VCC = 3.3 V
74LVC162374A; 74LVCH162374A
TYPICAL 3.8 150 5.0 30 ns
UNIT MHz pF pF
MATERIAL plastic plastic plastic plastic
CODE SOT370-1 SOT362-1 SOT370-1 SOT362-1
DESCRIPTION output enable input (active LOW)
13, 14, 16, 17, 19, 20, 22, 23 2Q0 to 2Q7
36, 35, 33, 32, 30, 29, 27, 26 2D0 to 2D7 47, 46, 44, 43, 41, 40, 38, 37 1D0 to 1D7 48 1CP
1999 Aug 05
3
Philips Semiconductors
Product specification
16-bit edge triggered D-type flip-flop with 30 series termination resistors; 5 V input/output tolerant; 3-state
74LVC162374A; 74LVCH162374A
handbook, halfpage
1OE 1 1Q0 1Q1 GND 1Q2 1Q3 VCC 1Q4 1Q5 2 3 4 5 6 7 8 9
48 1CP 47 1D0 46 1D1 45 GND 44 1D2 43 1D3 42 VCC 41 1D4 40 1D5 39 GND 38 1D6 37 1D7 1OE 47 46 44 43 41 40 38 37 36 35 36 2D0 35 2D1 34 GND 33 2D2 32 2D3 31 VCC 30 2D4 29 2D5 28 GND 27 2D6 26 2D7 25 2CP
MNA433
handbook, halfpage
1
24 2OE 1Q0 1Q1 1Q2 1Q3 1Q4 1Q5 1Q6 1Q7 2Q0 2Q1 2Q2 2Q3 2Q4 2Q5 2Q6 2Q7 2CP 25
MNA434
1D0 1D1 1D2 1D3 1D4 1D5 1D6 1D7 2D0 2D1 2D2 2D3 2D4 2D5 2D6 2D7 1CP 48
2 3 5 6 8 9 11 12 13 14 16 17 19 20 22 23
GND 10 1Q6 11 1Q7 12 2Q0 13 2Q1 14 GND 15 2Q2 16 2Q3 17 VCC 18 2Q4 19 2Q5 20 GND 21 2Q6 22 2Q7 23 2OE 24
162374A
33 32 30 29 27 26
Fig.1 Pin configuration.
Fig.2 Logic symbol.
1999 Aug 05
4
Philips Semiconductors
Product specification
16-bit edge triggered D-type flip-flop with 30 series termination resistors; 5 V input/output tolerant; 3-state
74LVC162374A; 74LVCH162374A
handbook, full pagewidth
1D0
D CP
Q
1Q0
2D0
D CP
Q
2Q0
FF1
FF2
1CP 1OE to 7 other channels
2CP 2OE to 7 other channels
MNA435
Fig.3 Logic diagram.
handbook, halfpage
1OE 1CP
1 48 24 25 47 46 44 43 41 40 38 37 36 35 33 32 30 29 27 26
1EN C3 2EN C2 1D 1 2 3 5 6 8 9 11 12 2D 2 13 14 16 17 19 20 22 23
MNA436
2OE 2CP 1D0 1D1 1D2 1D3 1D4 1D5 1D6 1D7 2D0 2D1 2D2 2D3 2D4 2D5 2D6 2D7
1Q0 1Q1 1Q2 1Q3 1Q4 1Q5 1Q6 1Q7 2Q0 2Q1 2Q2 2Q3 2Q4 2Q5 2Q6 2Q7
MNA428
handbook, halfpage
VCC
input
to internal circuit
Fig.4 IEC logic symbol.
Fig.5 Bus hold circuit.
1999 Aug 05
5
Philips Semiconductors
Product specification
16-bit edge triggered D-type flip-flop with 30 series termination resistors; 5 V input/output tolerant; 3-state
RECOMMENDED OPERATING CONDITIONS
74LVC162374A; 74LVCH162374A
LIMITS SYMBOL VCC PARAMETER DC supply voltage for max. speed performance for low-voltage applications VI VO DC input voltage range DC output voltage range output HIGH or LOW state 3-state Tamb tr, tf operating ambient temperature input rise and fall times see DC and AC characteristics per device VCC = 1.2 to 2.7 V VCC = 2.7 to 3.6 V 0 0 -40 0 0 VCC 5.5 +85 20 10 V V C ns/V ns/V 2.7 1.2 0 3.6 3.6 5.5 V V V CONDITIONS MIN. MAX. UNIT
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). Voltages are referenced to GND (ground = 0 V). SYMBOL VCC IIK VI IOK VO PARAMETER DC supply voltage DC input diode current DC input voltage DC output diode current DC output voltage output HIGH or LOW output 3-state IO IGND, ICC Tstg Ptot Note 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. DC output diode current DC VCC or GND current storage temperature power dissipation plastic shrink mini-pack (SSOP and TSSOP) above 60 C derate linearly with 5.5 mW/K note 1 note 1 VO = 0 to VCC -0.5 -0.5 - - -65 - VCC + 0.5 +6.5 50 100 +150 500 V V mA mA C mW VI < 0 note 1 VO > VCC or VO < 0 CONDITIONS - -0.5 - MIN. -0.5 MAX. +6.5 -50 +5.5 50 UNIT V mA V mA
1999 Aug 05
6
Philips Semiconductors
Product specification
16-bit edge triggered D-type flip-flop with 30 series termination resistors; 5 V input/output tolerant; 3-state
DC CHARACTERISTICS Over recommended operating conditions; voltage are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL PARAMETER OTHER VIH VIL VOH HIGH-level input voltage LOW-level input voltage HIGH-level output voltage VCC (V) 1.2 1.2 VI = VIH or VIL; IO = -6 mA 2.7 VI = VIH or VIL; IO = -100 A VI = VIH or VIL; IO = -12 mA VOL LOW-level output voltage VI = VIH or VIL; IO = 6 mA VI = VIH or VIL; IO = 100 A II IOZ Ioff ICC ICC IBHL IBHH IBHLO IBHHO Notes 1. All typical values are at VCC = 3.3 V and Tamb = 25 C. input leakage current 3-state output OFF-state current power off leakage supply quiescent supply current VI = 5.5 V or GND; note 2 VI = VIH or VIL; VO = 5.5 V or GND VI or VO = 5.5 V VI = VCC or GND; IO = 0 3.0 3.0 2.7 3.0 MIN. VCC -
74LVC162374A; 74LVCH162374A
Tamb (C) -40 to +85 TYP.(1) - - - - - VCC - - - - 0.1 0.1 0.1 0.1 5 - - - - MAX. - - GND 0.8 - - - 0.40 0.20 0.55 5 5 10 20 500 - - - - A A A A A A A A A V V V V UNIT
2.7 to 3.6 2.0 2.7 to 3.6 - VCC - 0.5 VCC - 0.2 VCC - 0.8 - - - - - - -
VI = VIH or VIL; IO = 12 mA 3.0 3.6 3.6 0.0 3.6
additional quiescent supply VI = VCC - 0.6 V; IO = 0 current per control pin bus hold LOW sustaining current bus hold HIGH sustaining current bus hold LOW overdrive current bus hold HIGH overdrive current VI = 0.8 V; notes 3, 4 and 5 VI = 2.0 V; notes 3, 4 and 5 VI = 0.8 V; notes 3, 4 and 6 VI = 0.8 V; notes 3, 4 and 6
2.7 to 3.6 - 3.0 3.0 3.6 3.6 75 -75 500 -500
2. For bus hold parts, the bus hold circuit is switched off when VI exceeds VCC allowing 5.5 V on the input terminal. 3. Valid for data inputs of bus hold parts (LVCH162374A) only. 4. For data inputs only, control inputs do not have a bus hold circuit. 5. The specified sustaining current at the data input holds the input below the specified VI level. 6. The specified overdrive current at the data input forces the data input to the opposite logic input state.
1999 Aug 05
7
Philips Semiconductors
Product specification
16-bit edge triggered D-type flip-flop with 30 series termination resistors; 5 V input/output tolerant; 3-state
AC CHARACTERISTICS GND = 0 V; tr = tf 2.5 ns; Tamb = -40 to +85 C.
74LVC162374A; 74LVCH162374A
LIMITS SYMBOL PARAMETER WAVEFORMS VCC = 3.3 V 0.3 V MIN. tPHL/tPLH tPZH/tPZL tPHZ/tPLZ tW tsu th fmax Note 1. Typical values at VCC = 3.3 V and Tamb = 25 C. propagation delay nCP to nQn 3-state output enable time nOE to nQn 3-state output disable time nOE to nQn see Figs 6 and 9 see Figs 8 and 9 see Figs 8 and 9 1.5 1.5 1.5 3 2.0 +1.5 100 TYP.(1) 3.8 4.1 3.7 1.5 0.3 -0.3 - MAX. 6.2 7.1 5.2 - - - - VCC = 2.7 V MIN. 1.5 1.5 1.5 3.0 2.0 1.5 80 MAX. 7.2 8.1 6.2 - - - - ns ns ns ns ns ns MHz UNIT
nCP pulse width HIGH or see Fig.6 LOW set-up time nDn to nCP hold time nDn to nCP maximum clock pulse frequency see Fig.7 see Fig.7 see Fig.6
1999 Aug 05
8
Philips Semiconductors
Product specification
16-bit edge triggered D-type flip-flop with 30 series termination resistors; 5 V input/output tolerant; 3-state
AC WAVEFORMS
74LVC162374A; 74LVCH162374A
handbook, full pagewidth
1/fmax VI nCP INPUT GND tW t PHL VOH nQn OUTPUT VOL VM
MNA437
VM
VM
t PLH
Fig.6
Clock input (nCP) to output (nQn) propagation delay, the clock pulse width and the maximum clock pulse frequency.
handbook, full pagewidth
VI nCP INPUT GND t su th VI nDn INPUT GND VM t su th VM
VOH nQn OUTPUT VOL VM
MNA438
The shaded areas indicate when the input is permitted to change for predictable output performance.
Fig.7 Data set-up and hold times for the nDn input to the nCP input.
1999 Aug 05
9
Philips Semiconductors
Product specification
16-bit edge triggered D-type flip-flop with 30 series termination resistors; 5 V input/output tolerant; 3-state
74LVC162374A; 74LVCH162374A
handbook, full pagewidth
VI nOE INPUT GND t PLZ VCC nQn OUTPUT LOW-to-OFF OFF-to-LOW VOL t PHZ VOH nQn OUTPUT HIGH-to-OFF OFF-to-HIGH GND outputs enabled outputs disabled outputs enabled
MNA432
VM
t PZL
VM VX t PZH VY VM
Fig.8 3-state enable and disable times.
handbook, full pagewidth
S1 VCC PULSE GENERATOR VI D.U.T. RT CL 50 pF RL 500 VO RL 500
2 x VCC open GND
MNA296
TEST tPLH/tPHL tPLZ/tPZL tPHZ/tPZH
S1 open 2 x VCC GND VCC <2.7 V 2.7 - 3.6 V VCC 2.7 V VI
Definitions for test circuit: RL = Load resistor; see Chapter "AC Characteristics". CL = Load capacitance including jig and probe capacitance (see Chapter "AC Characteristics"). RT = Termination resistance should be equal to the output impedance Zo of the pulse generator.
Fig.9 Load circuitry for switching times.
1999 Aug 05
10
Philips Semiconductors
Product specification
16-bit edge triggered D-type flip-flop with 30 series termination resistors; 5 V input/output tolerant; 3-state
PACKAGE OUTLINES SSOP48: plastic shrink small outline package; 48 leads; body width 7.5 mm
74LVC162374A; 74LVCH162374A
SOT370-1
D
E
A X
c y HE vM A
Z 48 25
Q A2 A1 (A 3) Lp 1 bp 24 wM L detail X A
pin 1 index
e
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 2.8 A1 0.4 0.2 A2 2.35 2.20 A3 0.25 bp 0.3 0.2 c 0.22 0.13 D (1) 16.00 15.75 E (1) 7.6 7.4 e 0.635 HE 10.4 10.1 L 1.4 Lp 1.0 0.6 Q 1.2 1.0 v 0.25 w 0.18 y 0.1 Z (1) 0.85 0.40 8 0o
o
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT370-1 REFERENCES IEC JEDEC MO-118AA EIAJ EUROPEAN PROJECTION
ISSUE DATE 93-11-02 95-02-04
1999 Aug 05
11
Philips Semiconductors
Product specification
16-bit edge triggered D-type flip-flop with 30 series termination resistors; 5 V input/output tolerant; 3-state
74LVC162374A; 74LVCH162374A
TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm
SOT362-1
D
E
A X
c y HE vMA
Z
48
25
Q A2 A1 pin 1 index Lp L (A 3) A
1
e bp
24
wM
detail X
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions). UNIT mm Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT362-1 REFERENCES IEC JEDEC MO-153ED EIAJ EUROPEAN PROJECTION A max. 1.2 A1 0.15 0.05 A2 1.05 0.85 A3 0.25 bp 0.28 0.17 c 0.2 0.1 D (1) 12.6 12.4 E (2) 6.2 6.0 e 0.5 HE 8.3 7.9 L 1 Lp 0.8 0.4 Q 0.50 0.35 v 0.25 w 0.08 y 0.1 Z 0.8 0.4 8 0o
o
ISSUE DATE 93-02-03 95-02-10
1999 Aug 05
12
Philips Semiconductors
Product specification
16-bit edge triggered D-type flip-flop with 30 series termination resistors; 5 V input/output tolerant; 3-state
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. Manual soldering
74LVC162374A; 74LVCH162374A
If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1999 Aug 05
13
Philips Semiconductors
Product specification
16-bit edge triggered D-type flip-flop with 30 series termination resistors; 5 V input/output tolerant; 3-state
Suitability of surface mount IC packages for wave and reflow soldering methods
74LVC162374A; 74LVCH162374A
SOLDERING METHOD PACKAGE WAVE BGA, SQFP HLQFP, HSQFP, HSOP, SMS PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications. not suitable not not not suitable(2) recommended(3)(4) recommended(5) suitable suitable suitable suitable suitable suitable REFLOW(1)
1999 Aug 05
14
Philips Semiconductors
Product specification
16-bit edge triggered D-type flip-flop with 30 series termination resistors; 5 V input/output tolerant; 3-state
NOTES
74LVC162374A; 74LVCH162374A
1999 Aug 05
15
Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 68 9211, Fax. +359 2 68 9102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 800 943 0087 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V, Tel. +45 33 29 3333, Fax. +45 33 29 3905 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615 800, Fax. +358 9 6158 0920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 4099 6161, Fax. +33 1 4099 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 2353 60, Fax. +49 40 2353 6300 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI), Tel. +39 039 203 6838, Fax +39 039 203 6800 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 58088 Newville 2114, Tel. +27 11 471 5401, Fax. +27 11 471 5398 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SAO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 62 5344, Fax.+381 11 63 5777
For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1999
Internet: http://www.semiconductors.philips.com
SCA 67
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
245004/01/pp16
Date of release: 1999
Aug 05
Document order number:
9397 750 05975

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